Tinning Solution 125mL

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125.00 EGP 125.0 EGP 125.00 EGP

125.00 EGP

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Internal Reference: TINNING.SOLUTION

PRODUCT DESCRIPTION 

Liquid Tin is a clear immersion tin designed and formulated to coat a copper substrate or solder deposit with a dense tin deposit. This deposit is readily solderable with a long shelf life. 

The tin deposit owes its outstanding corrosion protection to its dense coating and absence of co-deposited organics. Liquid Tin will clean solder deposits and render the surface active and bright, ensuring good solderability. 

It has the benefit of:

  • High metal concentration
  • Clear solution even at room temperature
  • Dense tin deposit, long shelf life
  • Residues are free rinsing
  • Very stable solution

SOLUTION MAKE-UP Liquid Tin is used at full strength and therefore requires no mixing or dilution 

RECOMMENDED PROCESS CYCLE Copper:

  1. Clean board
  2. Rinse
  3. Liquid Tin
  4. Warm water rinse
  5. Deionized water rinse
  6. Dry

The treatment of solder-plated parts requires no pre-cleaner, except in cases of severe contamination of the surface. In these cases, an alkaline soak cleaner, an acid soak cleaner, or a proprietary solder cleaner may be used.