PRODUCT DESCRIPTION
Liquid Tin is a clear immersion tin designed and formulated to coat a copper substrate or solder deposit with a dense tin deposit. This deposit is readily solderable with a long shelf life.
The tin deposit owes its outstanding corrosion protection to its dense coating and absence of co-deposited organics. Liquid Tin will clean solder deposits and render the surface active and bright, ensuring good solderability.
It has the benefit of:
- High metal concentration
- Clear solution even at room temperature
- Dense tin deposit, long shelf life
- Residues are free rinsing
- Very stable solution
SOLUTION MAKE-UP Liquid Tin is used at full strength and therefore requires no mixing or dilution
RECOMMENDED PROCESS CYCLE Copper:
- Clean board
- Rinse
- Liquid Tin
- Warm water rinse
- Deionized water rinse
- Dry
The treatment of solder-plated parts requires no pre-cleaner, except in cases of severe contamination of the surface. In these cases, an alkaline soak cleaner, an acid soak cleaner, or a proprietary solder cleaner may be used.