Thermal Conductive Double-Sided Adhesive Tape Width 25mm - 1 Roll 10M

https://ram-electronics.odoo.com/web/image/product.template/9593/image_1920?unique=e9c4720

Double Face Thermal Heat Conductive Tape
For Heat Sink

200.00 EGP 200.0 EGP 200.00 EGP

200.00 EGP

Not Available For Sale

This combination does not exist.

 Pick up from RAM Store
 Shipping: 2-3 Business Days


Internal Reference: HS.TAPE.25MM

Thermal Conductive Double-Sided Adhesive Tape – Thermal Adhesive Cooling Tape for Heatsinks, LED Lights, IC Chips, CPU, GPU

Product Overview

Thermal conductive double-sided adhesive tape is a versatile cooling solution designed to provide strong adhesion and efficient heat transfer between heat-generating components (like CPUs, GPUs, IC chips, LED modules, etc.) and heatsinks or cooling plates. It combines structural bonding with thermal conductivity, making it ideal for electronics assembly, thermal management, and component cooling.

Key Features
  • Double-sided adhesive for secure, permanent mounting of heatsinks and cooling components
  • Thermally conductive material improves heat dissipation from chips and power components
  • Thin and flexible — conforms to irregular surfaces and maximizes contact area
  • Non-electrically conductive (select grades) — safe for use on sensitive electronics
  • Adhesive strength suitable for LED lights, IC chips, CPUs, GPUs, MOSFETs, power modules and heatsinks
  • Easy to cut to custom shapes and sizes for specific applications
  • Clean application — no liquid glue or curing required
Technical Specifications (Typical)
  • Material: Thermal conductive adhesive polymer
  • Thermal Conductivity: approx. 0.8 – 6.0 W/m·K (varies by product grade)
  • Thickness: 0.15mm
  • Width: 25mm
  • Roll Length: 10 meters
  • Operating Temperature: –40 °C to +150 °C (varies by product)
  • Adhesive Type: Double-sided pressure-sensitive
  • Color: Usually white or grey
  • Dielectric Strength: Non-conductive (most common types)
Benefits
  • Faster and cleaner heatsink installation compared to traditional thermal paste
  • Acts as both adhesive and thermal interface material (TIM)
  • No curing time — immediate bonding
  • Improves reliability and longevity of thermal interfaces
Applications
  • Bonding heatsinks to CPUs, GPUs, and IC chips
  • Thermal management for LED lighting modules
  • Heat transfer for power electronics and motor drivers
  • Mounting cooling plates in embedded systems and industrial boards
  • DIY and prototyping thermal solutions
Usage Tips
  • Ensure surfaces are clean and dry before applying (use isopropyl alcohol)
  • Cut tape slightly larger than the heatsink pad to ensure full contact
  • Press firmly for good adhesion
  • Avoid stretching the tape during application