RMA-223 Soldering PASTE Flux (10cc)
مرجع داخلي:
RMA223.PASTE
Specifications:
RMA-223 is a moderately active rosin-type soldering paste that is widely used in the SMD repair process of mobile phone boards. It is a wash-free soldering paste with a very light color and a very high SIR value. It is recommended for BGA, CSP, and other ball matrix solder joint repairs and ball repairs. It provides good insulation and a smooth welding surface; it does not deteriorate or dry out. It offers good immersion and high-strength joints, and it is non-toxic and non-corrosive.
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